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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
Demande d'information
At 3D PLUS, we specialize in providing top-tier space qualified memory solutions designed to meet the rigorous demands of space applications. Our radiation tolerant SPI NOR Flash memories are engineered to deliver outstanding performance and high resistance in the harshest environments.
Our radiation tolerant SPI NOR Flash memories are latch-up immune and operate at 3.3 V, featuring a small pin count and a serial interface. These memories are designed with no bad blocks, high endurance, and long-term data retention, ensuring reliable performance over extended periods. Packaged in SOP for high resistance Surface Mount (SMT) assembly, our memories are built to withstand harsh thermal and mechanical conditions, making them ideal for space missions.
Our product line is divided into two sub-families to respond to different needs:
QSPI Modules: These modules offer high density and high speed, operating at up to 133 MHz. They are perfect for applications requiring fast data transfer and large storage capacities.
TMR Modules: These modules provide SEU immunity through triple modular redundancy and better TID tolerance via an integrated switch. They are designed for applications where data integrity and radiation tolerance are critical.
First released in 2018, our 3D PLUS SPI NOR Flash memories have been successfully used as configuration memory for SRAM-based FPGAs and as boot/program memory for leading processors. These memory modules have been deployed in missions such as EMIT, SEACOM and others, demonstrating their reliability and high resistance in demanding space environments.
Radiation Tolerant: Designed to withstand the radiation levels encountered in space.
High Resistance: Built to endure harsh thermal and mechanical conditions.
Reliable Performance: Proven track record in space missions, ensuring data integrity and longevity.
Up to 133 MHz for QSPI, 50 MHz for TMR modules
Small footprint
Radiation tolerance for QSPI modules:
TID > 20 krad(Si)
SEL LETth > 62.5 MeV.cm²/mg
SEU LETth > 15.0 MeV.cm²/mg; σsat = 7.5e-11 cm²/bit
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Industrial (I)
Space qualified (S)
20 years data retention
100, 000 erase/program cycles
Radiation tolerance for TMRed modules:
TID > 20 krad (Si) mode ON
TID > 40 krad(Si) mode OFF
SEU Immune by TMR
Long life cycle products with proven reliability in Space
No pure tin guarantee
Large and worldwide flight heritage
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder
TMR module with SEU immunity
EMIT goal is to map the world’s mineral-dust sources, gather information about particle color and composition. Thus to improve climate comprehension and modelling.
